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Hot Sale Silver Lead Free SMT Solder Paste For SMD Soldering SMD Components
Specifications:
Product name: Solder Paste
Alloy: Sn99Ag0.3Cu0.7
Size: μm: 25~45
Application: fine space 400μm, super fine space with NO.5
melting point: 217~219
metal content%: 89.5~90.2
conglutination: 700~1000Pa.s
life: 12 months
module life: >24 hours
printing speed: most 150mm/s
adhere time: >24 hours
Description:
Main ingredients is KF, KBF4, B2O3, composite fluorine borates composite borates, activator and so on. Excluding banned substances
Its performance is stable usage convenience, long-term storage not solidify, activity is strong, good fluidity.
Application:
Lead-free solder flux pastes is suitable in repairs of SMD and so on handset PCB, BGA and PGA helps the soldering paste, it uses activator of system in the low iconicity, the Run tin speed is quick, the belching smoke degree is very low, after the residuum solidifies, the surface insulation resistance value is very high, therefore, electric properties of disturbances to communication product and so on handset is small.
CONTACT US
Terrence Trading Limited
Contact Person: Jo Wan
Mobile Phone: +86-18823363695
Email: terrenetradingltd@foxmail.com
Skype: licpao2324
QQ: 3104221453
Address: Baoan District, Shenzhen, China
E-mail: 